Fabrication and Characterization of Embedded Passive Components for Low Cost Organic RF SOP Applications
In this paper, embedded passive components are investigated into the PCB substrate for low cost RF SOP applications. PCB embedded spiral inductors, MIM capacitors, and low pass filters are designed, fabricated and characterized by using 3D EM simulator, 8 layered PCB standard process, and HP 8510B network analyzer for verifying their applicability. The fabricated embedded spiral inductor has inductance of 9.4 nH at 800 MHz and maximum quality factor of 64.8 at 1.09 GHz and the embedded MIM capacitor has capacitance of 4.8 pF and maximum quality factor of 36.5 at 1 GHz. The fabricated embedded LPF has cutoff frequency of 2GHz at the insertion loss of −0.472 dB and return loss of −32.8 dB. The measured performance characteristics are well matched with the simulated ones.