Fully Embedded High Q circular stacked spiral inductors into- Organic substrate
In this paper, fully embedded circular-stacked spiral inductors are investigated into a multilayered PCB substrate for low cost and miniaturized RF system on package (SOP) applications. The embedded circular-stacked inductors are optimally designed to obtain high quality factor and self-resonant frequency by using 3D EM simulator. The fabricated two-turn circular-stacked inductor has an inductance of 8.4 nH and a maximum quality factor of 67 at 1.2 GHz. The device size of the staked inductor is ∼65% of the planar inductor. The measured performance characteristics are well matched with the 3D EM-simulated ones. The embedded circular stacked spiral inductors are promising for organic-based SOP, which needs various functionality, low cost, small size and volume, and high packaging density.
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