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Fully embedded LC diplexer passive circuit into an organic package substrate

Fully embedded LC diplexer passive circuit into an organic package substrate

In this article, fully embedded and miniaturized diplexer passive circuit device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The embedded inductor and capacitor have quality factors of 61 and 32 at 1 GHz. The fabricated diplexer has insertion losses and isolations of −0.5 and −23 dB at 824–894 MHz and −0.7 and −22 dB at 1850–1990 MHz, respectively. Its size is 3.9 mm × 3.9 mm × 0.77 mm (height). The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

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