Graduation Ceremony
Reflecting the rapid growth of the MEMS field and the commitment and success of its research community, the IEEE MEMS Conference series has evolved into a premier annual event in the MEMS area
The objective of the PowerMEMS Conference is to catalyze innovation in micro and nano technology in support of power/energy generation, conversion and storage applications as well as micro/nanosystem-enabled energy-efficient applications.
The PowerMEMS conference provides an excellent opportunity to bring together world scientists and engineers from academia, research institutes and companies to present and discuss the latest results in the general fields of miniaturized devices and systems for power generation and energy conversion in micro and nano scales.
Winter Graduation 2022
Hiking to Dobong Mountain, 2021
Congratulation to Hyunok Cho (PhD)
Congratulation to all the graduates.
Graduation of Hyosang Yoon (PhD), Pukar Maharjan (PhD), Ashok Chhettri (PhD), Toyabur Rahman (PhD), Young Do Shin (Bachelor), Dongkyun Kim (Bachelor).
Hiking to Suraksan Mountain, 2020
The 33rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2020) is one of the premier annual events reporting research results on every aspect of Microsystems technology. This conference reflects from the rapid proliferation of the commitment and success of the Microsystems research community. In recent years, the IEEE MEMS Conference has attracted more than 700 participants, 800+ abstract submissions and has created the forum to present over 200 select papers in podium and poster/oral sessions. Its single-session format provides ample opportunity for interaction between attendees, presenters and exhibitors. IEEE MEMS 2020 will be held in Vancouver, British Columbia, from January 18 - 22, 2020. The major areas of activity in the development of MEMS solicited and expected at this conference include but are not limited to:
- Design, simulation and analysis tools with experimental verification
- Fabrication technologies and processes
- Silicon and non-silicon materials
- Electro-mechanical integration techniques
- Assembly and packaging approaches
- Metrology and operational evaluation techniques
- System architecture
The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to:
- Mechanical, thermal, and magnetic sensors and actuators, and system
- Opto-mechanical microdevices and microsystems
- Fluidic microcomponents and microsystems
- Microdevices for data storage
- Microdevices for biomedical engineering
- Micro chemical analysis systems
- Microdevices and systems for wireless communication
- Microdevices for power supply and energy harvesting
- Nano-electro-mechanical devices and systems
- Scientific microinstruments
